Profil public Lynngui

Lynngui 
  • 3/5
Détails
Profil d'évaluation : 3/5
Nombre d'évaluations : 0

Vendeur inscrit depuis le 17 juin 2016
Lieu ou se trouve le vendeur : Baoan

Chine (Rép. pop) 518101 Matières premières
Offer Thermal Tape

Samedi 16 novembre 2024

Thermal Tape/gap filler/thermally conductive tape: High temperature resistance High thermally conductive Self adhesive Thermal Solution: thermal pad, gap filler, gap pad, thermal putty, thermal gel, thermal grease, phase change materials, EMI absorption thermal interface materials...

Goldlink Tongda Electronics Co., Ltd

  • 518101 - Baoan
  • 86 755 27579310
Chine (Rép. pop) 518101 Matières premières
Offer Graphene Thermal Sheet

Vendredi 15 novembre 2024

Graphene Thermal Sheet: High thermal performance Small size, light weight Thermal solution: thermal pad, gap filler, gap pad, thermal putty, thermal gel, thermal grease, phase change materials, EMI absorption thermal interface materials and silicone free types, etc. Localisation ...

Goldlink Tongda Electronics Co., Ltd

  • 518101 - Baoan
  • 86 755 27579310
Chine (Rép. pop) 518101 Matières premières
Offer Electrostatic Discharge Thermal Pad

Samedi 09 novembre 2024

Electrostatic Discharge Thermal Pad: Electrostatic discharge Comformable Designed for mid-stress applications Electrically isolating Thermal solution business includes thermal pad, gap filler, gap pad, thermal putty, thermal gel, thermal grease, EMI absorption thermal interface...

Goldlink Tongda Electronics Co., Ltd

  • 518101 - Baoan
  • 86 755 27579310
Chine (Rép. pop) 518101 Véhicule
Offer Thermal Pads for Electrical Vehicle battery

Samedi 23 juillet 2016

Thermal pad/ thermal gap filler pad: Designed for Electrical Vehicle Battery Thermal Management System. Low density Ultra conformable Low stress application Fiberglass reinforced Localisation : Rm616,619, Huafeng Xianan Building, Block45, Baoan, Shenzhen, China, 518101 Baoan...

Goldlink Tongda Electronics Co., Ltd

  • 518101 - Baoan
  • 86 755 27579310
Chine (Rép. pop) 518101 Matières premières
Offer Stressless Thermal Putty Gel

Samedi 23 juillet 2016

Thermal Interface Materials including thermal pad, gap filler, gap pad, thermal putty, thermal Gel, EMI absorption thermal materials. Thermal Putty Gel/thermal gap filler: For UAV design and northbridge IC Excellent compressibility Low thermal resistance Good creep performance...

Goldlink Tongda Electronics Co., Ltd

  • 518101 - Baoan
  • 86 755 27579310