Fastlink Electronics Through Hole PCB Assembly Supplier

Through Hole Pcb Assembly Design Process

The through-hole PCB fabrication and assembly design process involves several steps to ensure proper component placement and secure soldering. When working with a reliable service provider like Fastlink Electronics in China, the following steps are typically followed:

Component Placement: The first step is to determine the optimal placement of through-hole components on the PCB. This includes selecting appropriate footprints and considering factors such as component height and spacing.

Drilling and Plating: After component placement, holes are drilled in the PCB at designated locations. The holes are then plated to ensure proper electrical conductivity and connection between layers.

Component Insertion: Through-hole components are inserted into the pre-drilled holes on the PCB. The leads of the components extend through the board.

Wave Soldering: The PCB is passed through a wave soldering machine, where a wave of molten solder is used to solder the through-hole components. The solder forms strong electrical and mechanical connections between the component leads and the PCB.

Inspection and Testing: The assembled PCB undergoes thorough inspection and testing to ensure proper solder joints, component alignment, and electrical connectivity. Any issues or defects are identified and addressed during this stage.

Cleaning and Finishing: After successful inspection, the PCB is cleaned to remove any flux residue or contaminants. It is then finished with any necessary coatings or protective layers.

Surface mount through hole PCB assembly is commonly used for components that require high mechanical strength or when hand soldering is preferred. Fastlink Electronics, as a reputable electronics manufacturer in China, has expertise in through-hole PCB assembly, ensuring precise component placement and reliable soldering for optimal product performance.

PCA printed circuit assembly

HOW DOES THROUGH HOLE PCB ASSEMBLY WORK?

Step 1

The hole and pad to be soldered are prepared, with the lead being placed into/through the hole. The lead should be placed in such a way as to keep the bend above the soldered area to reduce heat and solder requirements.

Step 2

Heat is applied evenly to the lead and the pad/hole, heating the material so the solder will adhere to both surfaces.

Step 3

The solder contacts the end of the iron, which leads the solder to change into a liquid and flow into the hole.

Step 4

The solder flows through the hole, creating a mound on both the bottom and topside. Since this lead was soldered from the top side, the bottom side should be inspected for adequate solder and joint quality. Some assembly may require solder from both sides to ensure quality. Adequate clearance inside the hole allows good solder flow through the board, allowing only one side to have solder applied. Tight clearances may require soldering on both sides, increasing soldering time.

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