Vitrine de WENDYFOUR Shenzhen Semshine Tech Co., Ltd

Lundi 05 janvier 2015

Quantité : MOQ 1 piec

1 Description PCB Specification 2 Material FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum 3 Layer 1-20 4 Board Thickness 0.2mm- 4.0mm 5 Board Thickness Tolerance +/-10% 6 Copper thickness 17.5um-175um (0.5oz-5oz) 7 Min Trace Width 0.15mm 8 Min Space Width 0.15mm 9 Min Drilling Dia 0...