Ceramic metalization
| Description : | 1.high precision, good electrical and thermal properties, high bonding strength of. 2.good weldability, blind hole through hole can be realized 3.mature technology, environmental protection, pollution-free, cost is lower than traditional technology. 4.a wide range of applications, single-sided, double-sided three-dimensional ceramic circuit board can be produced. 5.customized production, without mold opening, short production cycle. |
| Features : | 1.high precision, good electrical and thermal properties, high bonding strength of. 2.good weldability, blind hole through hole can be realized 3.mature technology, environmental protection, pollution-free, cost is lower than traditional technology. 4.a wide range of applications, single-sided, double-sided three-dimensional ceramic circuit board can be produced. 5.customized production, without mold opening, short production cycle. |
Personne à contacter : Guotao Yu, +18 1 86 12 99 34
Bonne affaire : acheter au vendeur
Nous vous invitons à lire nos conditions générales d'utilisations. Vous pouvez aussi vous rendre sur nos FAQ et consulter notre page d'informations sur les risques liés à la contrefaçon.
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Cette page concerne les importateurs et exportateurs de Ceramic metalization Rechercher dans la catégorie : Informatique Rechercher dans la catégorie : metalization, ceramic |
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