EMMC eMCP test socket all in one,3in1 socket with USB Interface, for BGA153 BGA169 BGA1...

Expert maker of IC test socket for 15 years
Shenzhen Kaizhitong Microelectronics Technology is is an international company specialized in the export of all types of electronic components, burn in socket , eMMC socket , eMCP socket , LGA/SOP/TSOP/QFP/QFN socket , with high quality and competitive prices.

Meeting International Standards
Our products are manufactured under ISO 14001 and ISO 9001 guidelines, and meet UL, CSA, CE and FCC standards.


Aiming at Exceeding Clients' Specifications
Our main manufacturing plant is located in Guangdong, mainland China, and our production line and QC department are always devoted to making perfect products. Our solid expertise and extensive experience in the peripheral and component industry ensure our products will be at or better than the requested specifications.


Cooperate with Us Today
We work side by side with our customers to create a mutually beneficial relationship. We firmly believe in the development of long-term relationships with our customers and vendors, and understand the needs of the markets and how to deliver high-quality and excellent products. We also offer speedy shipping and excellent after-sales support. OEM services are provided. Contact us today.

1. Apply to eMCP and eMMC of Sumsung, Sandisk, Toshiba, Hynix, Micron, MTK and Intel.

2. Apply to BGA153 BGA169 BGA162 BGA186 BGA221.(just need to change the coupled socket)

3. Easy operation by just inserting the USB into PC.

4. This product is suitable for eMCP and eMMC size of 11.5x13mm, we also provide another size of 12x16mm,12x18mm,14x18mm.Only one frame guide for each socket default, please tell us you wanted size. If need more, you should pay another $10 for per standard size plate.

5. Apply to eMCP/eMMC thickness of 0.8 to 1.5mm

6. BGA162/BGA186 socket With 17 pins and pin pitch 0.5mm.

BGA221 socket With 36 pins and pin pitch 0.5mm.

BGA153/BGA169 socket With 30 pins and pin pitch 0.5mm.

7. Life cycle is around 25000 times.

8. eMCP/eMMC data can be read and re-written easily.

9. Support flat bottom and solder ball testing.