Matières premières
Antistatic Material PEEK R&D Series |
Material Properties |
Test Method |
Conditions |
Units |
770G |
Mechanical Data |
||||
Tensile Strength |
ISO 527 |
B reak,23℃ |
MPa |
- |
Y ield,23℃ |
MPa |
100 |
||
Tensile Elogation |
ISO 527 |
Break,23℃ |
% |
45 |
Flexural Strength |
ISO 178 |
Break,23℃ |
MPa |
- |
Y ield,23℃ |
MPa |
165 |
||
Fleoural Modulus |
ISO 178 |
23℃ |
Gpa |
4.1 |
Compressive Strength |
ISO 604 |
23℃ |
MPa |
125 |
Charpy Impact Strength |
ISO 179/leA |
Notched |
kJm-2 |
7 |
ISO 179/IU |
Unnotched |
kJm-2 |
- |
|
Izod Impact Strength |
ISO 180/A |
Notched |
kJm-2 |
7.5 |
ISO 180/U |
Unnotched |
kJm-2 |
- |
|
Mould Shrinkage |
ISO 294-4 |
Along flow |
% |
1 |
Across flow |
% |
1.3 |
||
Thermal Data |
||||
Melting Point |
ISO 11357 |
|
℃ |
343 |
Glass Tansition (Tg) |
ISO 11357 |
Onset |
℃ |
143 |
Special Heat Capacity |
DSC |
23℃ |
kj kg-1℃-1 |
2.2 |
Coefficient of Thermal Expansion |
ISO 11359 |
Along flow below Tg |
ppm K-1 |
45 |
Along flow above Tg |
ppm K-1 |
120 |
||
Heat Deflecion Temperature |
ISO 75A-f |
1.8Mpa |
℃ |
152 |
Thermal Conductivity |
ASTM C177 |
23℃ |
W m-1K-1 |
0.29 |
Flow |
||||
MeltIndex |
ISO 1133 |
380℃,5kg |
g10min-1 |
10 |
Miscellaneous |
||||
Density |
ISO 1186 |
Crystalline |
gcm-3 |
1.3 |
Amorphous |
gcm-3 |
1.26 |
||
Shore D Hardness |
ISO 868 |
23℃ |
|
85 |
Water Absorption(3.2mm thick Tensile Bar) |
ISO 62-1 |
24h,23℃ |
% |
0.07 |
by immersion |
|
Equilib riu m,23℃ |
% |
0.4 |
Electrical Data |
||||
Dielectric Strength |
IEC 60243-1 |
2mm |
kV mm-1 |
23 |
Comparative Tracking Index |
IEC 60112 |
|
V |
150 |
Dielectric Constant |
IEC 60250 |
23℃,1kHz |
|
3.1 |
23℃,50kHz |
|
3 |
||
Loss Tangent |
IEC 60250 |
23℃,1MHz |
|
0.004 |
Volume Resistivity |
IEC 60093 |
23℃,1V |
Ω cm |
10 16 |
275℃ |
Ω cm |
10 9 |
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Cette page concerne les importateurs et exportateurs de Antistatic Material PEEK R&D Series Rechercher dans la catégorie : Matières premières Rechercher dans la catégorie : antistatic, material, peek, series |
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